? semiconductor components industries, llc, 2012 june, 2012 ? rev. 9 1 publication order number: nl27wzu04/d nl27wzu04 dual unbuffered inverter the nl27wzu04 is a high performance dual unbuffered inverter operating from a 1.65 to 5.5 v supply. these devices are well suited for use as oscillators, pulse shapers, and in many other applications requiring a high ? input impedance amplifier. for digital applications, the nl27wz04 is recommended. features ? designed for 1.65 v to 5.5 v v cc operation ? unbuffered for crystal oscillator and analog applications ? lvcmos compatible ? source/sink 16 ma @ 4.5 v v cc ? near zero static supply current substantially reduces system power requirements ? chip complexity: fet = 72; equivalent gate = 18 ? these devices are pb ? free and are rohs compliant ? nlv prefix for automotive and other applications requiring unique site and control change requirements; aec ? q100 qualified and ppap capable v cc in a1 out y1 gnd in a2 out y2 1 figure 1. pinout (top view) figure 2. logic symbol in a2 out y2 1 out y1 in a1 1 2 34 5 6 pin assignment 1 2 3in a2 in a1 gnd 4 5v cc out y2 out y1 6 see detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. ordering information marking diagrams sc ? 88/sot ? 363/sc ? 70 df suffix case 419b tsop ? 6 dt suffix case 318g http://onsemi.com 1 6 m6 m 1 m6 = device code m = date code* = pb ? free package (note: microdot may be in either location) *date code orientation and/or position may vary depending upon manufacturing location. 6 m6 m m pin function function table l a input y output h hl
nl27wzu04 http://onsemi.com 2 maximum ratings symbol characteristics value units v cc dc supply voltage ? 0.5 to +7.0 v v i dc input voltage ? 0.5 v i v cc v v o dc output voltage ? 0.5 to +7.0 v i ik dc input diode current v i < gnd ? 50 ma i ok dc output diode current v o < gnd v o > v cc ? 50 +50 ma i o dc output sink current 50 ma i cc dc supply current per supply pin 100 ma i gnd dc ground current per ground pin 100 ma t stg storage temperature range ? 65 to +150 c p d power dissipation in still air sc ? 88, tsop ? 6 200 mw ja thermal resistance sc ? 88, tsop ? 6 333 c/w t l lead temperature, 1 mm from case for 10 s 260 c t j junction temperature under bias +150 c v esd esd withstand voltage human body model (note 1) machine model (note 2) charged device model (note 3) > 2000 > 200 n/a v i latchup latchup performance above v cc and below gnd at 85 c (note 4) 500 ma stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. 1. tested to eia/jesd22 ? a114 ? a. 2. tested to eia/jesd22 ? a115 ? a. 3. tested to jesd22 ? c101 ? a. 4. tested to eia/jesd78. recommended operating conditions symbol parameter min max units v cc supply voltage operating data retention only 1.65 1.5 5.5 5.5 v v i input voltage 0 5.5 v v o output voltage (high or low state) 0 5.5 v t a operating free ? air temperature ? 55 +125 c t/ v input transition rise or fall rate v cc = 2.5 v 0.2 v v cc = 3.0 v 0.3 v v cc = 5.0 v 0.5 v 0 0 0 20 10 5 ns/v
nl27wzu04 http://onsemi.com 3 dc electrical characteristics symbol parameter condition v cc (v) t a = 25 c ? 55 c t a 125 c units min typ max min max v ih high ? level input voltage 1.65 to 1.85 0.85 v cc 0.85 v cc v 2.3 to 5.5 0.8 v cc 0.8 v cc v il low ? level input voltage 1.65 to 1.85 0.15 v cc 0.15 v cc v 2.3 to 5.5 0.2 v cc 0.2 v cc v oh high ? level output voltage v in = v il i oh = ? 100 a 1.65 to 5.5 v cc ? 0.1 v cc ? 0.1 v v in = gnd i oh = ? 3 ma 1.65 1.29 1.52 1.29 i oh = ? 4 ma 2.3 1.9 2.1 1.9 i oh = ? 6 ma 2.7 2.2 2.3 2.2 i oh = ? 8 ma 3.0 2.4 2.6 2.4 i oh = ? 12 ma 3.0 2.3 2.5 2.3 i oh = ? 16 ma 4.5 3.8 4.2 3.8 v ol low ? level output voltage v in = v ih i ol = 100 a 1.65 to 5.5 0.1 0.1 v v in = v cc iol = 3 ma 1.65 0.08 0.24 0.24 i ol = 4 ma 2.3 0.12 0.3 0.3 i ol = 6 ma 2.7 0.20 0.4 0.4 i ol = 8 ma 3.0 0.24 0.4 0.4 i ol = 12 ma 3.0 0.26 0.55 0.55 i ol = 16 ma 4.5 0.31 0.55 0.55 i in input leakage current v in = 5.5 v or gnd 0 to 5.5 0.1 1.0 a i off power off leakage current v in = 5.5 v or v out = 5.5 v 0 1 10 a i cc maximum quiescent supply current v in = 5.5 v or gnd 5.5 1.0 10 a ????????????????????????????????? ????????????????????????????????? ac electrical characteristics t r = t f = 2.5 ns; c l = 50 pf; r l = 500 ???? ???? ???? symbol ??????? ??????? ??????? ??????? ??????? ??????? ???? ???? ???? ???????? ???????? c ??????? ??????? 55 c t a 125 c ?? ?? ?? ???? ???? ?? ?? ???? ???? ???? ???? ???? ???? ???? ???? ???? ???? ???? ???? ???? t plh t phl ??????? ??????? ??????? ??????? ??????? ??????? ??????? ??????? ??????? , c l = 50 pf ???? ???? 0.15 ???? ???? ?? ?? ???? ???? ???? ???? ???? ???? ?? ?? ?? ?? ?? ?? ?? ??????? ??????? , c l = 15 pf ???? ???? 0.2 ???? ???? ?? ?? ???? ???? ???? ???? ???? ???? ??????? ??????? , c l = 15 pf ???? ???? ???? 0.3 ???? ???? ?? ?? ???? ???? ???? ???? ???? ???? ??????? ??????? , c l = 50 pf ???? ???? ?? ?? ???? ???? ???? ???? ???? ???? ??????? ??????? , c l = 15 pf ???? ???? ???? 0.5 ???? ???? ?? ?? ???? ???? ???? ???? ???? ???? ??????? ??????? , c l = 50 pf ???? ???? ?? ?? ???? ???? ???? ???? ???? ???? capacitive characteristics symbol parameter condition typical units c in input capacitance v cc = 5.5 v, v i = 0 v or v cc 7 pf c out output capacitance v cc = 5.5 v, v i = 0 v or v cc 8 pf c pd power dissipation capacitance (note 5) 10 mhz, v cc = 5.5 v, v i = 0 v or v cc 25 pf 5. c pd is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption with out load. average operating current can be obtained by the equation: i cc(opr ) = c pd v cc f in + i cc . c pd is used to determine the no ? load dynamic power consumption; p d = c pd v cc 2 f in + i cc v cc .
nl27wzu04 http://onsemi.com 4 v cc gnd 50% 50% v cc a or b y t phl t plh figure 3. switching waveforms propagation delays t r = t f = 2.5 ns, 10% to 90%; f = 1 mhz; t w = 500 ns pulse generator r t dut v cc r l c l figure 4. test circuit c l = 50 pf or equivalent (includes jig and probe capacitance) r l = r 1 = 500 or equivalent r t = z out of pulse generator (typically 50 ) ordering information device package shipping ? nl27wzu04dft2g sc ? 88 / sot ? 363 / sc ? 70 (pb ? free) 3000 / tape & reel NLV27WZU04DFT2G* sc ? 88 / sot ? 363 / sc ? 70 (pb ? free) 3000 / tape & reel nl27wzu04dtt1g tsop ? 6 (pb ? free) 3000 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. *nlv prefix for automotive and other applications requiring unique site and control change requirements; aec ? q100 qualified and ppap capable.
nl27wzu04 http://onsemi.com 5 package dimensions notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. 419b ? 01 obsolete, new standard 419b ? 02. e 0.2 (0.008) mm 123 d e a1 a a3 c l 654 ? e ? b 6 pl sc ? 88/sc70 ? 6/sot ? 363 case 419b ? 02 issue w dim min nom max millimeters a 0.80 0.95 1.10 a1 0.00 0.05 0.10 a3 b 0.10 0.21 0.30 c 0.10 0.14 0.25 d 1.80 2.00 2.20 0.031 0.037 0.043 0.000 0.002 0.004 0.004 0.008 0.012 0.004 0.005 0.010 0.070 0.078 0.086 min nom max inches 0.20 ref 0.008 ref h e h e e 1.15 1.25 1.35 e 0.65 bsc l 0.10 0.20 0.30 2.00 2.10 2.20 0.045 0.049 0.053 0.026 bsc 0.004 0.008 0.012 0.078 0.082 0.086 mm inches scale 20:1 0.65 0.025 0.65 0.025 0.50 0.0197 0.40 0.0157 1.9 0.0748 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint*
nl27wzu04 http://onsemi.com 6 package dimensions ? 6 case 318g ? 02 issue u 23 4 5 6 d 1 e b e1 a1 a 0.05 notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. maximum lead thickness includes lead finish. minimum lead thickness is the minimum thickness of base material. 4. dimensions d and e1 do not include mold flash, protrusions, or gate burrs. mold flash, protrusions, or gate burrs shall not exceed 0.15 per side. dimensions d and e1 are determined at datum h. 5. pin one indicator must be located in the indicated zone. c *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* dim a min nom max millimeters 0.90 1.00 1.10 a1 0.01 0.06 0.10 b 0.25 0.38 0.50 c 0.10 0.18 0.26 d 2.90 3.00 3.10 e 2.50 2.75 3.00 e 0.85 0.95 1.05 l 0.20 0.40 0.60 0.25 bsc l2 ? 0 1 0 1.30 1.50 1.70 e1 e recommended note 5 l c m h l2 seating plane gauge plane detail z detail z 0.60 6x 3.20 0.95 6x 0.95 pitch dimensions: millimeters m on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. nl27wzu04/d publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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